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Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium


Quantity:  pieces  
Product information

Item number:
     4MD6L-374224B00035G
Manufacturer:
     BOYD CORP
Manufacturer no.:
     374224B00035G
EAN/GTIN:
     n/a
Search terms:
FPGA
Field-programmable gate array
Heatsink
Heatsinks
Manufacturer: BOYD CORP
Width: 23mm
Material: aluminium
Height: 25mm
Length: 23mm
Application: BGA;FPGA
Type of heatsink: extruded
An overview of the conditions1
Delivery period
Stock level
Price
from € 1.89*
  
Price is valid from 210,000 pieces
Minimum order quantity: 420 pieces
Select conditions yourself
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Staggered prices
Order quantity
Net
Gross
Unit
from 420 pieces
€ 2.03*
€ 2.50
per piece
from 2100 pieces
€ 2.01*
€ 2.47
per piece
from 4200 pieces
€ 1.97*
€ 2.42
per piece
from 210000 pieces
€ 1.89*
€ 2.32
per piece
* Prices with asterisk are net prices excl. statutory VAT.
Our offer is only aimed at companies, public institutions and freelancers.