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Heatsink: extruded; BGA,FPGA; L: 35mm; W: 35mm; H: 27.9mm; aluminium

Quantity:

pieces

Product information

Item number:
4MD6L-372024B00032G

Manufacturer:
BOYD CORP

Manufacturer no.:
372024B00032G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Width: 35mm
Material: aluminium
Height: 27.9mm
Length: 35mm
Application: BGA;FPGA
Type of heatsink: extruded

... > Warehouse 4MD6L > Semiconductors - accessories > Heatsinks

Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks, extruded heat sinks

An overview of the conditions¹

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Stock level

Price

from € 3.52*

Price is valid from 168,000 pieces

Minimum order quantity: 336 pieces

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Staggered prices

Order quantity	Net	Gross	Unit

from 336 pieces	€ 3.75*	€ 4.61	per piece
from 672 pieces	€ 3.72*	€ 4.58	per piece
from 1680 pieces	€ 3.60*	€ 4.43	per piece
from 3360 pieces	€ 3.55*	€ 4.37	per piece
from 168000 pieces	€ 3.52*	€ 4.33	per piece

* Prices with asterisk are net prices excl. statutory VAT.

Our offer is only aimed at companies, public institutions and freelancers.

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