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| Item number:
CIEN9-1802633 Manufacturer no.:
493764-B21 EAN/GTIN:
n/a |
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| These Intel Xeon processors, with extended lifecycle support,
utilize Intel’s Hafnium-based 45nm Hi-k silicon process technology
to reduce power consumption, increase switching speed,
and significantly increase transistor density over previous 65nm
technology to 820 million transistors.
These 45nm processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms
for a wide range of applications. These include storage area networks, network attached storage, routers, IP-PBX, converged/unified
communications platforms, sophisticated content firewalls, unified threat management systems, medical imaging equipment, military
signal and image processing, and telecommunications (wireless and wireline) servers. More information: Other features | Intel® Virtualization Technology (Intel® VT) | VT-x | Processor special features | Enhanced Intel SpeedStep Technology | Yes | | Intel Virtualization Technology (VT-x) | Yes | Features | Execute Disable Bit | Yes | | Idle States | Yes | | Thermal Monitoring Technologies | Yes | | Market segment | Server | | Number of Processing Die Transistors | 820 M | | Processing Die size | 214 mm² | Operational conditions | Tcase | 57 °C | Processor | Processor family | Intel® Xeon® 5000 Sequence | | Processor cores | 4 | | Processor socket | LGA 771 (Socket J) | | Processor lithography | 45 nm | | Processor model | L5430 | | Processor base frequency | 2.66 GHz | | Processor operating modes | 64-bit | | Component for | Server/workstation | | Processor cache | 12 MB | | Processor cache type | L2 | | Processor front side bus | 1333 MHz | | Thermal Design Power (TDP) | 50 W | | VID Voltage Range | 0.850 - 1.3500 V | | FSB Parity | Yes | Weight & dimensions | Processor package size | 37.5 mm |
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| Other search terms: Xeon, intel cpu, processor, CPU, CPUs, AMD, Intel, Dual-Core, Athlon, Quad processor, opteron, celeron, sempron, pentium, xeon, turion, pentium 4 |
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