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| Item number: CIEN7-66913680 Manufacturer no.: KBG30ZMS512G EAN/GTIN: 8592978180201 |
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| The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint. BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage. The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available. More information: Operational conditions | Operating temperature (T-T) | 0 - 80 °C | | Storage temperature (T-T) | -40 - 85 °C | | Operating vibration | 196 G | | Non-operating vibration | 20 G | | Operating shock | 14.7 G | | Non-operating shock | 1.5 G | Power | Operating voltage | 3.3 V | | Power consumption (read) | 3.3 W | | Power consumption (write) | 3.3 W | Logistics data | Harmonized System (HS) code | 84717070 | Features | SSD form factor | M.2 | | SSD capacity | 512 GB | | Interface | PCI Express 3.1 | | Memory type | TLC | | NVMe | Yes | | Component for | Notebook | | Read speed | 1500 MB/s | | Write speed | 1000 MB/s | Weight & dimensions | Width | 22 mm | | Depth | 30 mm | | Height | 2.38 mm | | Weight | 2.42 g |
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