Processor | Processor family | Intel® Xeon® |
 | Processor manufacturer | Intel |
| Processor model | 6148 |
| Processor frequency | 2.4 GHz |
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor boost frequency | 3.7 GHz |
| Processor cores | 20 |
| Processor cache | 27.5 MB |
| Memory channels supported by processor | Hexa |
| Number of processors installed | 4 |
| Thermal Design Power (TDP) | 150 W |
| Processor cache type | L3 |
| Processor socket | LGA 3647 (Socket P) |
| Processor lithography | 14 nm |
| Processor threads | 40 |
| Processor operating modes | 64-bit |
| Stepping | H0 |
| Processor codename | Skylake |
| Tcase | 86 °C |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| ECC supported by processor | Yes |
| Execute Disable Bit | Yes |
| Maximum number of PCI Express lanes | 48 |
| Processor package size | 76.0 x 56.5 mm |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Processor code | SR3B6 |
| Scalability | S4S |
| Conflict-Free processor | Yes |
Design | Chassis type | Rack (2U) |
| Rack mounting | Yes |
| Redundant fans support | Yes |
| Rack rails | Yes |
Graphics | On-board graphics card model | Matrox G200 |
Sustainability | Sustainability certificates | ENERGY STAR |
Processor special features | Enhanced Intel SpeedStep Technology | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel TSX-NI | Yes |
| Intel 64 | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel TSX-NI version | 1.00 |
| Processor ARK ID | 120489 |
Memory | Internal memory | 128 GB |
| Internal memory type | DDR4-SDRAM |
| Maximum internal memory | 6000 GB |
| Memory slots | 48x DIMM |
| ECC | Yes |
| Memory clock speed | 2666 MHz |
| Memory layout (slots x size) | 4 x 32 GB |
Operational conditions | Operating temperature (T-T) | 5 - 45 °C |
| Storage temperature (T-T) | -10 - 60 °C |
| Operating relative humidity (H-H) | 8 - 90 % |
| Storage relative humidity (H-H) | 8 - 90 % |
| Operating altitude | 0 - 3048 m |
Expansion slots | PCI Express x8 (Gen 3.x) slots | 7 |
| PCI Express x16 (Gen 3.x) slots | 2 |
| PCI Express slots version | 3.0 |
Power | Redundant power supply (RPS) support | Yes |
| Power supply | 1600 W |
| Number of redundant power supplies installed | 2 |
Weight & dimensions | Width | 482 mm |
| Depth | 763.7 mm |
| Height | 86.5 mm |
Ports & interfaces | USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity | 3 |
| VGA (D-Sub) ports quantity | 1 |
| Serial ports quantity | 1 |
Storage | RAID support | Yes |
| Supported HDD sizes | 2.5 " |
| RAID levels | 0, 1, 5, 6, 10, 50, 60 |
| Supported RAID controllers | 930-8i |
| Hot-swap | Yes |
| Supported storage drive interfaces | SAS, Serial ATA III, M.2 |
Performance | Performance management | XClarity Advanced |
| Trusted Platform Module (TPM) | Yes |
| Trusted Platform Module (TPM) version | 1.2 |