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Heatsink: extruded; grilled; BGA,FPGA; black; L: 15.3mm; W: 15.2mm

Quantity:

pieces

Product information

Item number:
4MD6L-375424B00034G

Manufacturer:
BOYD CORP

Manufacturer no.:
375424B00034G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Colour: black
Width: 15.2mm
Material: aluminium
Height: 6.35mm
Length: 15.3mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized

... > Warehouse 4MD6L > Semiconductors - accessories > Heatsinks

Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks, extruded heat sinks

An overview of the conditions¹

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Price

from € 1.06*

Price is valid from 1,680,000 pieces

Minimum order quantity: 3360 pieces

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Staggered prices

Order quantity	Net	Gross	Unit

from 3360 pieces	€ 1.12*	€ 1.38	per piece
from 6720 pieces	€ 1.11*	€ 1.37	per piece
from 16800 pieces	€ 1.08*	€ 1.33	per piece
from 33600 pieces	€ 1.07*	€ 1.32	per piece
from 1680000 pieces	€ 1.06*	€ 1.30	per piece

* Prices with asterisk are net prices excl. statutory VAT.

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