Product range
My Mercateo
Sign in / Register
Basket
 
 

Heatsink: extruded; grilled; BGA,FPGA; black; L: 10.2mm; W: 10.2mm


Quantity:  pieces  
Product information

Item number:
     4MD6L-375324B00035G
Manufacturer:
     BOYD CORP
Manufacturer no.:
     375324B00035G
EAN/GTIN:
     n/a
Search terms:
FPGA
Field-programmable gate array
Heatsink
Heatsinks
Manufacturer: BOYD CORP
Colour: black
Width: 10.2mm
Material: aluminium
Height: 10.2mm
Length: 10.2mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
An overview of the conditions1
Delivery period
Stock level
Price
from € 1.50*
  
Price is valid from 960,000 pieces
Minimum order quantity: 1920 pieces
Select conditions yourself
Share itemAdd item to shopping list
Staggered prices
Order quantity
Net
Gross
Unit
from 1920 pieces
€ 1.57*
€ 1.93
per piece
from 3840 pieces
€ 1.56*
€ 1.92
per piece
from 9600 pieces
€ 1.53*
€ 1.88
per piece
from 19200 pieces
€ 1.51*
€ 1.86
per piece
from 960000 pieces
€ 1.50*
€ 1.85
per piece
* Prices with asterisk are net prices excl. statutory VAT.
Our offer is only aimed at companies, public institutions and freelancers.