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Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm

Quantity:

pieces

Product information

Item number:
4MD6L-375224B00032G

Manufacturer:
BOYD CORP

Manufacturer no.:
375224B00032G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Colour: black
Width: 10.2mm
Material: aluminium
Height: 10.2mm
Length: 11.1mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized

... > Warehouse 4MD6L > Semiconductors - accessories > Heatsinks

Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks, extruded heat sinks

An overview of the conditions¹

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Price

from € 0.80*

Price is valid from 960,000 pieces

Minimum order quantity: 1920 pieces

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Staggered prices

Order quantity	Net	Gross	Unit

from 1920 pieces	€ 0.85*	€ 1.05	per piece
from 3840 pieces	€ 0.84*	€ 1.03	per piece
from 9600 pieces	€ 0.83*	€ 1.02	per piece
from 19200 pieces	€ 0.82*	€ 1.01	per piece
from 960000 pieces	€ 0.80*	€ 0.98	per piece

* Prices with asterisk are net prices excl. statutory VAT.

Our offer is only aimed at companies, public institutions and freelancers.

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