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Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm


Quantity:  pieces  
Product information

Item number:
     4MD6L-375224B00032G
Manufacturer:
     BOYD CORP
Manufacturer no.:
     375224B00032G
EAN/GTIN:
     n/a
Search terms:
FPGA
Field-programmable gate array
Heatsink
Heatsinks
Manufacturer: BOYD CORP
Colour: black
Width: 10.2mm
Material: aluminium
Height: 10.2mm
Length: 11.1mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
An overview of the conditions1
Delivery period
Stock level
Price
€ 0.82*
  
Price is valid from 1,920 pieces
Orders only in multiples of 1,920 pieces
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Staggered prices
Order quantity
Net
Gross
Unit
from 1920 pieces
€ 0.82*
€ 1.01
per piece
from 3840 pieces
€ 0.81*
€ 1.00
per piece
from 9600 pieces
€ 0.79*
€ 0.97
per piece
from 19200 pieces
€ 0.78*
€ 0.96
per piece
from 960000 pieces
€ 0.77*
€ 0.95
per piece
* Prices with asterisk are net prices excl. statutory VAT.
Our offer is only aimed at companies, public institutions and freelancers.