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Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm

Quantity:

pieces

Product information

Item number:
4MD6L-374424B60023G

Manufacturer:
BOYD CORP

Manufacturer no.:
374424B60023G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Colour: black
Width: 27mm
Material: aluminium
Height: 18mm
Length: 27mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized

... > Warehouse 4MD6L > Semiconductors - accessories > Heatsinks

Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks, extruded heat sinks

An overview of the conditions¹

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Stock level

Price

from € 3.08*

Price is valid from 108,000 pieces

Minimum order quantity: 216 pieces

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Staggered prices

Order quantity	Net	Gross	Unit

from 216 pieces	€ 3.33*	€ 4.10	per piece
from 432 pieces	€ 3.30*	€ 4.06	per piece
from 1080 pieces	€ 3.26*	€ 4.01	per piece
from 2160 pieces	€ 3.21*	€ 3.95	per piece
from 108000 pieces	€ 3.08*	€ 3.79	per piece

* Prices with asterisk are net prices excl. statutory VAT.

Our offer is only aimed at companies, public institutions and freelancers.

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