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Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm

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Product information

Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm

Item number:
4MD6L-374424B00035G

Manufacturer:
BOYD CORP

Manufacturer no.:
374424B00035G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Colour: black
Width: 27mm
Material: aluminium
Height: 18mm
Length: 27mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized

... > Warehouse 4MD6L > Semiconductors - accessories > Heatsinks

Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks, extruded heat sinks

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from € 2.45*

Price is valid from 7,500 pieces

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Staggered prices

Order quantity	Net	Gross	Unit

1 piece	€ 3.81*	€ 4.69	per piece
from 5 pieces	€ 3.52*	€ 4.33	per piece
from 10 pieces	€ 3.43*	€ 4.22	per piece
from 20 pieces	€ 3.42*	€ 4.21	per piece
from 50 pieces	€ 3.05*	€ 3.75	per piece
from 81 pieces	€ 2.85*	€ 3.51	per piece
from 7500 pieces	€ 2.45*	€ 3.01	per piece

* Prices with asterisk are net prices excl. statutory VAT.

Our offer is only aimed at companies, public institutions and freelancers.

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