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Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm

Quantity:

pieces

Product information

Item number:
4MD6L-374224B60023G

Manufacturer:
BOYD CORP

Manufacturer no.:
374224B60023G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Colour: black
Width: 23mm
Material: aluminium
Height: 25mm
Length: 23mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized

... > Warehouse 4MD6L > Semiconductors - accessories > Heatsinks

Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks, extruded heat sinks

An overview of the conditions¹

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Stock level

Price

from € 2.89*

Price is valid from 105,000 pieces

Minimum order quantity: 210 pieces

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Staggered prices

Order quantity	Net	Gross	Unit

from 210 pieces	€ 3.11*	€ 3.83	per piece
from 420 pieces	€ 3.10*	€ 3.81	per piece
from 1050 pieces	€ 3.08*	€ 3.79	per piece
from 2100 pieces	€ 3.03*	€ 3.73	per piece
from 105000 pieces	€ 2.89*	€ 3.55	per piece

* Prices with asterisk are net prices excl. statutory VAT.

Our offer is only aimed at companies, public institutions and freelancers.

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