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Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm


Quantity:  pieces  
Product information

Item number:
     4MD6L-374124B60023G
Manufacturer:
     BOYD CORP
Manufacturer no.:
     374124B60023G
EAN/GTIN:
     n/a
Search terms:
FPGA
Field-programmable gate array
Heatsink
Heatsinks
Manufacturer: BOYD CORP
Colour: black
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
An overview of the conditions1
Delivery period
Stock level
Price
from € 2.37*
  
Price is valid from 108,000 pieces
Minimum order quantity: 216 pieces
Select conditions yourself
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Staggered prices
Order quantity
Net
Gross
Unit
from 216 pieces
€ 2.56*
€ 3.15
per piece
from 432 pieces
€ 2.55*
€ 3.14
per piece
from 1080 pieces
€ 2.51*
€ 3.09
per piece
from 2160 pieces
€ 2.48*
€ 3.05
per piece
from 108000 pieces
€ 2.37*
€ 2.92
per piece
* Prices with asterisk are net prices excl. statutory VAT.
Our offer is only aimed at companies, public institutions and freelancers.