Start page > Computers & accessories > PC components > CPU > Heatsink > Extruded heat sink > Item

Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm

Quantity:

pieces

Product information

Item number:
4MD6L-335224B00034G

Manufacturer:
BOYD CORP

Manufacturer no.:
335224B00034G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Colour: black
Width: 25.02mm
Material: aluminium
Height: 9.91mm
Length: 25.02mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized

... > Warehouse 4MD6L > Semiconductors - accessories > Heatsinks

Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks, extruded heat sinks

An overview of the conditions¹

Delivery period

Stock level

Price

from € 1.30*

Price is valid from 420,000 pieces

Minimum order quantity: 840 pieces

Select conditions yourself

Share item

Add item to shopping list

Staggered prices

Order quantity	Net	Gross	Unit

from 840 pieces	€ 1.39*	€ 1.71	per piece
from 1680 pieces	€ 1.38*	€ 1.70	per piece
from 4200 pieces	€ 1.36*	€ 1.67	per piece
from 8400 pieces	€ 1.34*	€ 1.65	per piece
from 420000 pieces	€ 1.30*	€ 1.60	per piece

* Prices with asterisk are net prices excl. statutory VAT.

Our offer is only aimed at companies, public institutions and freelancers.

General Terms and Conditions