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Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm

Quantity:

pieces

Product information

Item number:
4MD6L-335224B00034G

Manufacturer:
BOYD CORP

Manufacturer no.:
335224B00034G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Colour: black
Width: 25.02mm
Material: aluminium
Height: 9.91mm
Length: 25.02mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized

... > Warehouse 4MD6L > Semiconductors - accessories > Heatsinks

Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks

An overview of the conditions¹

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€ 1.31*

Price is valid from 840 pieces

Orders only in multiples of 840 pieces

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Staggered prices

Order quantity	Net	Gross	Unit

from 840 pieces	€ 1.31*	€ 1.61	per piece
from 4200 pieces	€ 1.29*	€ 1.59	per piece
from 8400 pieces	€ 1.27*	€ 1.56	per piece
from 420000 pieces	€ 1.23*	€ 1.51	per piece

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