SMD Fuse, Temperature range: -40...+85 °C, PAD dimensions: A x B (reflow soldering) 2.0 x 3.75 mm, A x B (wave soldering) 3.2 x 4.5 mm, Characteristic (time/current): Slow-blow, Construction form: 10.1 x 3 x 3 mm, Resistance to soldering heat: 260 °C, 10 s, IEC 60068-2-58, Series: UMT250, Solderability: 245 °C, 10 s, IEC 60068-2-58, Rated voltage: 250 VAC/125 VDC, Voltage drop: 164 mV More information: | | Bruttogewicht: | 0.001 kg | Nettogewicht: | 0.001 kg | Höhe: | 3 mm | Breite: | 3 mm | Tiefe: | 10 mm | Ursprungsland: | DE |
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