|  |
| |
| Item number:
2072I-3307 Manufacturer no.:
HBFBZ10-6412-B EAN/GTIN:
0613165232423 |
|
|
| | |
| - Intel® Elkhart Lake SoC Processor
- 1 * DDR4 3200MHz SODIMM up to 16GB
- 4 * 2.5GbE
- Support TPM2.0
- 2 * USB , 1* HDMI, 1 * COM (RJ45 type)
- 1 * M.2-2242, 1 * M.2-2230, 1 * M.2-3042
- 12V DC-in
More information: | | Model: | – HBFBZ10-6412-B, – HBFBZ10I-6412-B, – HBFBZ10-6412-E (EMMC), – HBFBZ10I-6412-E (EMMC), – HBFBZ10-6412-T (EMMC&TPM;), – HBFBZ10I-6412-T (EMMC&TPM;), | CPU/Chipset: | – Intel® Elkhart Lake SoC Processor (J6412) | BIOS: | – AMI Flash ROM | Memory: | – 1* DDR4 3200MHz SO-DIMM up to 16GB | Network: | – 4* Intel i255V 2.5GbE | Graphics: | – Intel® HD Graphics, shared memory, – 1* HDMI 2.0 (Max Resolution: 4096×2160@60Hz) | Storage: | – 1* M.2 M-key (2242, PCIe Gen.3 x2/SATA interface) support NVME, (co-layout M.2 B-key) | Expansion slot: | – 1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface), – 1* M.2 B-key (3042/3052, USB3.1 interface) co-layout M.2 M-key, (If you use M.2 B-key type-3042/3052 card, M.2 M-key type-2242 is not available; vice versa) | Rear Panel I/O: | – 4* RJ45, – 1* COM (RJ45 type), – 1* DC-in jack | Front Panel I/O: | – 1* Power button + Power LED, – 1* Reset, – 1* USB3.1, – 1* USB2.0, – 1* HDMI (Max. 4096×2160@60Hz resolution) | Internal Connector: | – 32GB eMMC onboard (by model), – 1* SIM card holder | Compliance: | – CE, FCC, RoHS, ErP Ready | – CE, FCC, LVD, RoHS, ErP Ready | Power Source: | – MB : DC12V input, – Adapter : AC 90~240V input / DC12V-3.3A-40W output | Temperature: | – Operating Temperature: -20 ~ 60° C (Under the condition of using M.2 interface SSD), – Storage Temperature: -20 ~ 80° C, – Humidity: Between 40% and 60%, non-condensing | Dimensions: | – System: 125 (W) x 109 (D) x 39.5 (H) mm | OS Support: | – Windows 10, Windows 11, Linux | Gewicht: | 3.0 kg |
|
| | |
| | | |
| |