FPGA purchased inexpensively from Mercateo (Page 7/16)

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Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 35mm Material: aluminium Height: 10mm Length: 35mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized

BOYD CORP

374624B60024G

from € 3.53*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 27mm Material: plastic;aluminium Height: 24.5mm Length: 27mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing...

BOYD CORP

EA-270-H245-T710

from € 7.53*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 40mm Material: aluminium Height: 18mm Length: 40mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized

BOYD CORP

375024B00032G

from € 3.07*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 35mm Material: aluminium Height: 10mm Length: 35mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized

BOYD CORP

374624B00032G

from € 3.09*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm; H: 7mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 35mm Material: aluminium Height: 7mm Length: 35mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized

BOYD CORP

371824B00032G

from € 2.01*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 35mm Material: aluminium Height: 25mm Length: 35mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized

BOYD CORP

374824B60024G

from € 4.04*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 40mm Material: aluminium Height: 10mm Length: 40mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized

BOYD CORP

374924B00035G

from € 4.00*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 35mm Material: aluminium Height: 10mm Length: 35mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized

BOYD CORP

374624B00035G

from € 3.45*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 40mm Material: aluminium Height: 10mm Length: 40mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized

BOYD CORP

374924B60024G

from € 4.67*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 37.4mm; W: 37.4mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 37.4mm Material: aluminium Height: 10mm Length: 37.4mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anod...

BOYD CORP

10-5607-04G

from € 3.27*
per piece

IC: FPGA; SMD; FBGA400; Number of macrocells: 20k; I/O: 301; 275MHz (1 offer)

Manufacturer: INTEL Mounting: SMD Case: FBGA400 Supply voltage: 1.425...1.575V DC Frequency: 275MHz Type of integrated circuit: FPGA Quiescent current: 12mA Delay time: 8ns Number of inputs/outputs...

Intel

EP1C20F400C8N

from € 91.75*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40.13mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 40.13mm Material: aluminium Height: 11.43mm Length: 40mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: an...

BOYD CORP

364424B00032G

from € 3.70*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 45.2mm; W: 41.4mm (1 offer)

Manufacturer: BOYD CORP Colour: black Width: 41.4mm Material: aluminium Height: 11.68mm Length: 45.2mm Application: BGA;FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: a...

BOYD CORP

10-L4LB-11G

from € 1.93*
per piece

Heatsink: extruded; grilled; BGA,FPGA; black; L: 45.2mm; W: 41.4mm (1 offer)

BOYD CORP

10-L4LB-05G

from € 3.70*
per piece

IC: FPGA; SMD; PQFP208; Number of macrocells: 3072; I/O: 133; 272MHz (1 offer)

Manufacturer: MICROCHIP (MICROSEMI) Mounting: SMD Case: PQFP208 Supply voltage: 1.425...1.575V DC Frequency: 272MHz Type of integrated circuit: FPGA Quiescent current: 15mA Number of inputs/outputs...

MICROCHIP (MICROSEMI)

A3P125-1PQG208I

from € 19.93*
per piece

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FPGA (232 offers of 2,619,676 product items)

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