PCB, bonded paper, Dimensions L x W: 100 x 160 mm, Copper lamination: 35 µm single sided, Material type: Phenol hard-paper FR2, Board thickness: 1.5 mm
Printed circuit board epoxy, Dimensions L x W: 100 x 75 mm, Copper lamination: 35 µm single sided, Material type: FR4 epoxy resin, Board thickness: 1.0 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 35 µm single sided, Material type: FR4 epoxy resin, Board thickness: 0.5 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 35 µm double sided, Material type: FR4 epoxy resin, Board thickness: 0.5 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 35 µm double sided, Material type: FR4 epoxy resin, Board thickness: 0.8 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 35 µm single sided, Material type: FR4 epoxy resin, Board thickness: 1.0 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 35 µm single sided, Material type: FR4 epoxy resin, Board thickness: 1.55 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 35 µm double sided, Material type: FR4 epoxy resin, Board thickness: 1.55 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 105 µm single sided, Material type: FR4 epoxy resin, Board thickness: 1.55 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 35 µm single sided, Material type: FR4 epoxy resin, Board thickness: 1.5 mm
Printed circuit board epoxy, Dimensions L x W: 160 x 100 mm, Copper lamination: 35 µm double sided, Material type: FR4 epoxy resin, Board thickness: 1.5 mm
Printed circuit board epoxy, Dimensions L x W: 233 x 160 mm, Copper lamination: 35 µm double sided, Material type: FR4 epoxy resin, Board thickness: 1.55 mm
Printed circuit board epoxy, Dimensions L x W: 233 x 160 mm, Copper lamination: 105 µm single sided, Material type: FR4 epoxy resin, Board thickness: 1.55 mm
Printed circuit board epoxy, Dimensions L x W: 233 x 160 mm, Copper lamination: 35 µm single sided, Material type: FR4 epoxy resin, Board thickness: 1.5 mm
Printed circuit board epoxy, Dimensions L x W: 233 x 160 mm, Copper lamination: 35 µm double sided, Material type: FR4 epoxy resin, Board thickness: 1.5 mm
Printed circuit board epoxy, Dimensions L x W: 300 x 200 mm, Copper lamination: 35 µm double sided, Material type: FR4 epoxy resin, Board thickness: 1.0 mm
Printed circuit board epoxy, Dimensions L x W: 400 x 300 mm, Copper lamination: 35 µm single sided, Material type: FR4 epoxy resin, Board thickness: 1.55 mm
Printed circuit board epoxy, Dimensions L x W: 400 x 300 mm, Copper lamination: 35 µm double sided, Material type: FR4 epoxy resin, Board thickness: 1.55 mm